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Structure

N-Tetratetracontane

CAS
7098-22-8
Catalog Number
ACM7098228-1
Category
Main Products
Molecular Weight
619.2
Molecular Formula
C44H90

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Specification

Synonyms
ALKANE C44;N-TETRATETRACONTANE;TETRATETRACONTANE;TETRATETRACONTANE, STANDARD FOR GC;N-TETRATETRACONTANE, 500MG, NEAT;Tetratetracontane,96%;n-Tetratetracontane,96%;TETRATETRACONTANE 96%
IUPAC Name
tetratetracontane
Canonical SMILES
CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC
InChI Key
KMXFZRSJMDYPPG-UHFFFAOYSA-N
Boiling Point
547.6ºC at 760 mmHg
Melting Point
85-87°C(lit.)
Flash Point
448.2ºC
Density
0.82g/cm³
Appearance
light yellow powder
Complexity
411
Defined Atom Stereocenter Count
0
EC Number
230-407-0
Exact Mass
618.7042
Formal Charge
0
Heavy Atom Count
44
Hydrogen Bond Acceptor Count
0
Hydrogen Bond Donor Count
0
Isotope Atom Count
0
Monoisotopic Mass
618.7042
Rotatable Bond Count
41
Topological Polar Surface Area
0 Ų
WGK Germany
3
XLogP3-AA
23.4

Enhancing Ferroelectric OFET Performance via Surface Engineering: The Application of N-Tetratetracontane in Flexible Nonvolatile Memory Devices

Low-voltage programmable/erasable high performance flexible organic transistor nonvolatile memory based on a tetratetracontane passivated ferroelectric terpolymer Xu M, et al. Organic Electronics, 2019, 64, 62-70.

N-Tetratetracontane (TTC), a long-chain alkane, was applied as a passivation layer to optimize the semiconductor/dielectric interface in flexible ferroelectric organic field-effect transistor (Fe-OFET) nonvolatile memory (NVM) devices. The TTC layer was thermally deposited onto spin-coated P(VDF-TrFE-CTFE) ferroelectric terpolymer films at a rate of 0.5-1 Å/s, with deposition thickness precisely monitored using a quartz crystal oscillator. Post-deposition annealing at 75 °C for 2 hours was employed to smooth the TTC layer. This treatment significantly influenced the growth behavior of the overlying pentacene semiconductor, inducing a layer-by-layer growth mode that yielded enlarged crystalline grains and improved interfacial morphology. Subsequently, a 40 nm thick pentacene layer was thermally evaporated onto the dielectric surfaces, followed by sequential thermal deposition of Cu (60 nm)/MoO₃ (5 nm) to define source and drain electrodes. Devices fabricated on PEN substrates exhibited enhanced mobility (~0.5 cm² V⁻¹ s⁻¹), low programming/erasing voltage (±15 V), and stable electrical performance under mechanical bending. This study demonstrates the critical role of TTC in modulating interfacial properties to achieve high-performance, low-voltage, and mechanically durable flexible Fe-OFET NVMs.

Modifying Surface States via Molecular Adsorption: Application of n-Tetratetracontane on Au(111) for Shockley State Engineering

Modification of Shockley surface state by long-chain n-alkane: Photoemission study on tetratetracontane/Au(111) interface Kanai K, et al. Thin Solid Films, 2009, 517(11), 3276-3280.

The adsorption behavior and electronic influence of n-Tetratetracontane (n-C₄₄H₉₀, TTC) on Au(111) surfaces was systematically studied using angle-resolved ultraviolet photoemission spectroscopy (ARUPS). A single molecular layer of TTC was deposited via resistance heating of high-purity TTC contained in a quartz crucible under ultrahigh vacuum (< 2 × 10⁻⁹ Pa). The Au(111) substrate was cleaned through repeated Ar⁺ sputtering (1 keV) and annealing cycles at ~600 °C until the Shockley surface state peak was distinctly observed in the ARUPS spectrum.
Using a He I resonance line (hν = 21.218 eV) as the excitation source, spectra were acquired with a hemispherical energy analyzer (Omicron EA-125 HR) offering ~70 meV resolution. The TTC monolayer, adopting a flat-on configuration, induced a measurable energy shift (~160 meV) of the Shockley surface state toward the Fermi level, indicating significant modulation of the quasi-two-dimensional surface electron system.This study demonstrates TTC's utility in tuning metallic surface electronic structures through non-covalent molecular adsorption, offering valuable insight for molecular electronics and organic-metal interface engineering.

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