Aminopropyllsobutyl poss

• CAS: 444315-15-5
• Catalog Number: ACM444315155
• Category: Main Products
• Molecular Weight: 0
• Molecular Formula: C₃₁H₇₁NSi₈O₁₂
• Synonyms: Aminopropyllsobutyl POSS
• Appearance: White powder

Case Study

Aminopropylisobutyl POSS Used in the Synthesis Of POSS/PCL-Graphene Oxide Composites

Saltan, Fehmi, et al. Materials Research Express 6.12 (2019): 125328.

Graphene oxide-polycaprolactone (GO-PCL) composites incorporating POSS were synthesized via ring-opening polymerization.
Synthesis Strategy
Initially, AmidoPOSS-PDMP was produced using aminopropylisobutyl POSS (POSS-NH2) and protected 2,2-bis(hydroxymethyl)propionic acid (bis-PDMP). After deprotecting AmidoPOSS-PDMP by removing the acetonide group, functionalized POSS (AmidoPOSS-DMP) was obtained. This compound then reacted with graphene oxide to form AmidoPOSS-GO, and ultimately, the composite of POSS with graphene oxide and polycaprolactone (AmidoPOSS-GO-PCL) was created using ε-caprolactone and AmidoPOSS-GO.
Radiation Effects on Composites
Researchers evaluated how 10 kGy of gamma radiation affected PCL-GO and AmidoPOSS-GO-PCL composite materials. Both composites revealed negative effects from the low radiation dose which showed their insufficient radiation resistance. The FWO method revealed activation energies of 113 kJ/mol for irradiated PCL-GO and 94 kJ/mol for irradiated AmidoPOSS-GO-PCL which contrasted with 107 kJ/mol and 102 kJ/mol for their non-irradiated equivalents. Reduced cross-linking after irradiation likely caused the activation energy increase in POSS-GO.

Aminopropylisobutyl POSS Functionalized nBN Filler Improves Thermal Conductivity of PPS Dielectric Nanocomposites

Yang, Xutong, et al. Composites Part A: Applied Science and Manufacturing 101 (2017): 237-242.

The proposed method for combining the silane coupling agents γ-aminopropyl triethoxy silane and aminopropylisobutyl polyhedral oligomeric silsesquioxane (KH-560/NH2-POSS) was used to functionalize the surface of hexagonal nanometer boron nitride fillers (f-nBN). This approach aimed to create f-nBN/polyphenylene sulfide (f-nBN/PPS) nanocomposites that exhibit excellent thermal conductivity, remarkable thermal stability, and optimal dielectric properties.
Fabrication of Thermally Conductive PPS Dielectric Nanocomposites
The nBN fillers were first surface-functionalized using the KH-560/NH2-POSS method. The PPS matrix and nBN (or f-nBN) fillers were dried in a vacuum oven at 70°C for 4 hours and 6 hours, respectively. The preparation of the PPS nanocomposites followed these steps: The PPS matrix combined with nBN or f-nBN fillers underwent ball milling for 24 hours at room temperature before hot-compression molding at 295°C and 10 MPa to create the thermally conductive PPS dielectric nanocomposites.
Performance of f-nBN/PPS Nanocomposites
The f-nBN/PPS nanocomposite with 60 wt% f-nBN fillers demonstrated superior dielectric properties including a thermal conductivity of 1.122 W/m K which represents a 400% increase over the pristine PPS matrix as well as a dielectric constant of 3.99 and a thermal heat-resistance index of over 275°C. The characteristics of these materials indicate they have a strong potential for application in electronic packaging materials and equipment that operates at ultra-high voltages.