Ethylamine-borontrifluoride

• CAS: 75-23-0
• Catalog Number: ACM75230
• Category: Main Products
• Molecular Weight: 112.89
• Molecular Formula: C₂H₇BF₃N
• Synonyms: ETHYLAMINE TRIFLUOROBORANE;BORON FLUORIDE-ETHYLAMINE COMPLEX;Boron trifluoride ethylamine;BORON TRIFLUORIDE ETHYLAMINE COMPLEX;BORON TRIFLUORIDE MONOETHYLAMINE;BORON TRIFLUORIDE MONOETHYLAMINE COMPLEX;(ethanamine)trifluoro-,(T-4)-Boron;(t-4)-boron(ethanamine)trifluoro
• IUPAC Name: ethanamine;trifluoroborane
• InChI Key: JDVIRCVIXCMTPU-UHFFFAOYSA-N
• Melting Point: 85-89°C(lit.)
• Flash Point: 157°C
• Density: 1,38 g/cm³
• Appearance: light yellow flakes
• EC Number: 200-852-5
• Hazard Statements: C
• Safety Description: 26-36/37/39-45
• Supplemental Hazard Statements: H314-H302-H315-H319-H335
• Symbol: GHS05,GHS07

Case Study

Ethylamine-Borontrifluoride as a Key Component in Advanced Photothermal Dual-Curing Epoxy Adhesives

Liang, Shuo, et al. The Journal of Adhesion 101.9 (2025): 1097-1114.

One-component epoxy adhesives that incorporate ethylamine-boron trifluoride (BF3-MEA) are valued in electronics assembly for low curing temperatures and long shelf life. Traditionally these systems cure thermally via an Active Chain End (ACE) mechanism, but ACE can promote formation of cyclic oligomers that degrade final mechanical properties. Herein, a photothermal dual-curing system was developed using a blend of diglycidyl-4,5-epoxy-cyclohexane-1,2-dicarboxylate (TDE-85) epoxy resin, photoinitiator 1176, and BF3-MEA.
Key Results
· Mechanical performance: The optimal photothermal dual-cured formulation reached a shear strength of 13.9 ± 0.7 MPa and a hardness of 88 ± 4 Shore A.
· Performance gain vs thermal-only cure: Those values represent improvements of 118.2% (shear strength) and 18.9% (hardness) compared with adhesives cured solely by the traditional thermal ACE route.
· The hydroxyl groups that form in the photocuring stage inhibit the ACE mechanism and instead promote the Active Monomer (AM) mechanism, which effectively prevents cyclic oligomer formation, resulting in a more robust network.

Ethylamine-Borontrifluoride as a High-Performance Catalyst for Flame-Retardant Epoxy Composites

Seraji, Seyed Mohsen, et al. Macromolecular Chemistry and Physics 222.7 (2021): 2000342.

Rapid-curing epoxy systems that deliver low viscosity for liquid molding and produce flame-retardant, high-performance composites are in demand for high-throughput manufacturing. This study compared Lewis-acid (BF3·ethylamine) and Lewis-base (2-ethyl-4-methylimidazole, 2E4MI) catalysis in epoxy/amine formulations modified with DOPO, focusing on cure behavior, chemorheology and resulting flame retardancy.
Formulation & Processing: The studied formulations blended DGEBF and epoxidized phenol novolac with varying DOPO loadings, pre-reacted to form DOPO adducts, then were catalyzed with 0.5 phr of BF3·ethylamine (or 2E4MI for comparison) and stoichiometric DETDA; the systems maintained low viscosity and were cured under practical thermal schedules suitable for liquid molding and UL-94 testing.
Key Findings
· BF3·ethylamine accelerated the onset of reaction more strongly than the imidazole catalyst. Increasing DOPO content modestly retarded anionic/imidazole-catalyzed cure (2E4MI case), attributed to DOPO-derived hydroxyls interfering with anionic chain growth. By contrast, BF3-catalyzed cationic chain growth was not significantly hindered by higher DOPO loadings; the cationic pathway appears to establish a secondary propagating mechanism that maintains cure progression.
· Increasing DOPO reduced Tg in all networks; the imidazole-catalyzed networks experienced a larger Tg decrease than BF3-catalyzed networks. Across DOPO levels, formulations retained low viscosity and favorable flow/gelation characteristics compatible with liquid molding processes.
· UL-94: The cured DOPO-modified systems achieved a V0 rating under the reported cure regimen, indicating effective flame retardant performance.