Structure

Silicon Nitride Nanoparticle Dispersion

CAS
12033-89-5
Catalog Number
ACM12033895-2
Category
Inorganic Nanomaterials
Molecular Weight
140.28g/mol
Molecular Formula
Si3N4;N4Si3

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Specification

Description
DryPowder
Synonyms
Silicon Nitride nanopowder suspension, aqueous Silicon Nitride nanoparticle solution, Silicon Nitride nanofluid
IUPAC Name
2,4,6,7-tetraza-1,3,5-trisilahexacyclo[3.1.1.01,4.02,5.03,6.03,7]heptane
SMILES
N12[Si]34N5[Si]16N3[Si]25N46
InChI
InChI=1S/N4Si3/c1-5-2-6(1)3(5)7(1,2)4(5)6
InChI Key
HQVNEWCFYHHQES-UHFFFAOYSA-N
Boiling Point
Varies by solvent
Melting Point
Varies by solvent
Density
2.2 to 3.5 g/cm³
Appearance
Liquid dispersion
Application
Silicon Nitride Nanoparticle Dispersion serves as a versatile material primarily designed for the preparation of thermally conductive Poly(Me Methacrylate)/Silicon Nitride nanocomposites using click chemistry. Composed of silicon and nitrogen, silicon nitride (Si3N4) is renowned for its impressive properties, including high strength across a wide temperature range, outstanding fracture toughness, hardness, and wear resistance, as well as exceptional thermal shock resistance. This makes it highly suitable for diverse applications, such as engine parts in the automobile industry, manufacturing of bearings, and abrasive or cutting tools. Silicon nitride's ability to withstand severe thermal shocks makes it invaluable in aerospace applications, while its insulating and chemical barrier properties enhance the production of integrated circuits in electronics. Silicon Nitride Nanoparticle Dispersion, therefore, facilitates the integration of these beneficial attributes into various advanced material applications, offering a robust solution across multiple high-performance industries.
Bulk Density
1900g/cm³
Complexity
154
Covalently-Bonded Unit Count
1
EC Number
234-796-8
Electrical Resistivity
11 to 12 10x Ω-m
Exact Mass
139.943076g/mol
Formal Charge
0
H-Bond Acceptor
4
H-Bond Donor
0
Heavy Atom Count
7
MDL Number
MFCD00011230
Monoisotopic Mass
139.943076g/mol
Morphology
spherical
Ratio
0.24 to 0.27
Rotatable Bond Count
0
Specific Heat
720 to 800 J/kg-K
Specific Surface Area
103-123 m2/g
Thermal Conductivity
12 to 31 W/m-K
Thermal Expansion
2.5 to 3.2 µm/m-K
True Density
3200 kg/cm³
UNII
QHB8T06IDK
Young's Modulus
140 to 310 GPa

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