Polyimide resin

• CAS: 62929-02-6
• Catalog Number: ACM62929026
• Category: Other Products
• Molecular Weight: 588.606020 [g/mol]
• Molecular Formula: C₃₅H₂₈N₂O₇
• Synonyms: 1,3-Isobenzofurandione, 5,5-carbonylbis-, polymer with 1(or 3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or 1,1,3)-trimethyl-1H-inden-5-amine, 106442-40-4, 137178-42-8, 206770-41-4, 62929-02-6, 80497-95-6
• IUPAC Name: 1-(4-aminophenyl)-1,3,3-trimethyl-2H-inden-5-amine; 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione
• InChI Key: CDTDIQLZIBORMV-UHFFFAOYSA-N
• Boiling Point: 638.8ºC at 760 mmHg
• Melting Point: >300ºC
• Flash Point: 286.2ºC
• Density: 1.2
• Application: Polyimide resin is a highly versatile material known for its exceptional heat and fire resistance, making it ideal for high-temperature applications such as adhesives and composites. It serves a critical role in various industries due to its robust performance characteristics. In electronics, polyimide is used for flexible cables and as an insulating film on magnet wire. In the medical field, it is utilized for durable tubing, while its mechanical stress buffering capabilities provide added resilience. Additionally, polyimide resin's application extends to water purification through reverse osmosis films and the concentration of dilute materials like those in maple syrup production. Available in both thermoplastic and thermoset forms, polyimides are offered as laminates, molded parts, and thin-film products such as enamels and coatings. Notably, they maintain excellent structural integrity at continuous service temperatures of up to 260°C and can withstand intermittent exposure to temperatures as high as 482°C. With enhanced wear resistance and low friction coefficients, especially when combined with polytetrafluoroethylene fillers, polyimide parts deliver superior performance even under challenging conditions, maintaining their electrical properties across varying temperatures and humidity levels.
• Exact Mass: 588.19000
• H-Bond Acceptor: 9
• H-Bond Donor: 2