Parylene f

• CAS: 1785-64-4
• Catalog Number: ACM1785644
• Category: Other Products
• Molecular Weight: 352.22g/mol
• Molecular Formula: C16H8F8
• Synonyms: Dimer,Parylene F;5,6,11,12,13,14,15,16-Octafluorotricyclo[8.2.2.24,7]hexadeca-4,6,10,12,13,15-hexaene;Parylene F Dimer
• IUPAC Name: 5,6,11,12,13,14,15,16-octafluorotricyclo[8.2.2.24,7]hexadeca-1(12),4(16),5,7(15),10,13-hexaene
• Canonical SMILES: C1CC2=C(C(=C(CCC3=C(C(=C1C(=C3F)F)F)F)C(=C2F)F)F)F
• InChI: InChI=1S/C16H8F8/c17-9-5-1-2-6-11(19)15(23)8(16(24)12(6)20)4-3-7(13(9)21)14(22)10(5)18/h1-4H2
• InChI Key: GUHKMHMGKKRFDT-UHFFFAOYSA-N
• Density: 1.497
• Application: Parylene F serves as an advanced conformal coating solution designed to enhance the performance and longevity of electronic components, especially in high-temperature applications. Utilizing a vapor deposition process within a custom vacuum system, Parylene F forms a uniform barrier layer with thicknesses ranging from 2-50 microns, without the need for curing. This not only provides reliable protection against moisture, corrosive agents, and contaminants but also ensures waterproofing up to an IPX8 protection level, meeting stringent IPC, MIL, and NASA standards. Parylene F effectively prevents corrosion of printed circuit boards and electronic components, acts as a dielectric layer to protect against shorts and arcing, and mitigates tin whisker growth. It also offers thin film encapsulation to safeguard electronics from vibration or shock. Parylene F is uniquely capable of maintaining robust performance at elevated temperatures, thanks to its advanced material properties, although its use is restricted to medical devices and research and development applications.
• Complexity: 336
• Covalently-Bonded Unit Count: 1
• Exact Mass: 352.049826g/mol
• Formal Charge: 0
• H-Bond Acceptor: 8
• H-Bond Donor: 0
• Heavy Atom Count: 24
• Monoisotopic Mass: 352.049826g/mol
• Rotatable Bond Count: 0
• XLogP3: 5.2