809-73-4 Purity
98%
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Specification
Achilli, Elisabetta, et al. Inorganic Chemistry 56.12 (2017): 6982-6989.
Copper(II) lactate solutions are used as precursors for electrochemical production of copper(I) oxide (Cu2O) films. Understanding the solution speciation and electrochemical stability of the copper-lactate complex is critical for predictable deposition and for tuning film properties. This study applied energy-dispersive X-ray absorption spectroscopy (EDXAS), combined with EXAFS/XANES analysis and multiple-scattering simulations, to define the structure of the active complex in alkaline media and to assess its behavior under applied potentials.
Key Findings
· In alkaline solution with large lactate excess (reported ~15:1 ligand:Cu), the dominant species around copper(II) is a 1:4 Cu:lactate complex. Each Cu2+ is coordinated by four lactate anions acting as monodentate ligands, forming a distorted tetrahedral arrangement.
· This geometry yields two distinct oxygen shells: four short Cu-O distances (~1.87 Å) and four longer oxygen contacts (~3.1-3.2 Å) - the longer set arising from the spatial disposition of the ligand framework rather than additional strong bonds.
· Electrochemical stability was assessed via linear sweep voltammetry (LSV). The complex remained largely intact (≈80%) across a broad potential range (+1.2 V to -0.4 V vs. Ag/AgCl), confirming its robustness during electrodeposition. Minor Cu2O formation was attributed to interactions between the complex and metallic copper on the counter electrode.
Mahalingam, T., et al. Journal of Materials Science: Materials in Electronics 17.7 (2006): 519-523.
Cuprous oxide (Cu2O), a p-type semiconductor (≈2.0 eV band gap), is a material of considerable interest for low cost solar energy conversion. Electrodeposition from aqueous copper(II) complexes is a promising low temperature, scalable route to Cu2O thin films; copper(II) lactate solutions are frequently used as the soluble Cu(II) source in these electrolytes.
Aqueous baths containing Cu2+ complexed by lactate (can be prepared from cupric salt, lactic acid and NaOH) were used as the working electrolyte for cathodic generation of Cu2O on conductive substrates. The lactate complex provides a mechanism for controlled Cu(II) transport and reduction at the cathode, resulting in formation of compact Cu2O layers under defined electrochemical conditions. Optimum conditions were found to be: deposition potential -0.555 V vs SCE, pH ≈ 9.0 ± 0.1 and bath temperature 70 °C.
Material Characterization: The Copper(II) lactate-based deposition process was found to produce polycrystalline Cu2O films with a cubic structure and pyramid-shaped grains preferentially oriented along the (200) plane. Important parameters for the Cu2O films include a grain size of ~210 nm, resistivity of 1.6 × 106 ohm-cm, activation energy of 0.80 eV, and peak photoresponse at 600 nm, which corresponds to the Cu2O band gap. The films were thermally stable to 350°C, and no conversion to CuO was observed until higher temperatures. Photoelectrochemical cells fabricated with these films showed conversion efficiencies of 0.8% after suitable surface treatments.
The molecular formula of cupric lactate is C6H10CuO6.
The synonyms for cupric lactate are copper dilactate and copper lactate.
The molecular weight of cupric lactate is 241.69 g/mol.
The parent compound of cupric lactate is lactic acid.
Cupric lactate is described as greenish-blue crystals or granular powder.
The IUPAC name of cupric lactate is copper;2-hydroxypropanoate.
The InChI of cupric lactate is InChI=1S/2C3H6O3.Cu/c2*1-2(4)3(5)6;/h2*2,4H,1H3,(H,5,6);/q;;+2/p-2.
The InChIKey of cupric lactate is DYROSKSLMAPFBZ-UHFFFAOYSA-L.
The Canonical SMILES of cupric lactate is CC(C(=O)[O-])O.CC(C(=O)[O-])O.[Cu+2].
The CAS number of cupric lactate is 16039-52-4.
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