Copper Nanorods

• CAS: 7440-50-8
• Catalog Number: ACM7440508-2
• Category: Nanorods
• Molecular Weight: 63.55
• Molecular Formula: Cu
• Description: Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid.
• Synonyms: Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper
• IUPAC Name: copper
• Canonical SMILES: [Cu]
• InChI: InChI=1S/Cu
• InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N
• Boiling Point: 2562°C
• Melting Point: 1085°C
• Density: 8.96 g/cm³
• Solubility: Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble
• Appearance: Reddish Metal
• Color/Form: Reddish, lustrous, ductile, malleable metal;Red metal; cubic
• Complexity: 0
• Covalently-Bonded Unit Count: 1
• EC Number: 231-159-6
• Electrical Resistivity: 1.673 μΩ-cm @ 20°C
• Electronegativity: 1.90 Paulings
• Exact Mass: 62.929597g/mol
• Formal Charge: 0
• Hazard Codes: F
• Hazard Statements: H228-H400
• H-Bond Acceptor: 0
• H-Bond Donor: 0
• Heat of Fusion: 13.26 kJ·mol-1
• Heat of Vaporization: 300.4 kJ·mol-1
• Heavy Atom Count: 1
• ICSC Number: 0240
• LogP: -0.57 (calculated)
• MDL Number: MFCD00010965
• Monoisotopic Mass: 62.929597g/mol
• Odor: Odorless /Copper dusts and mists/
• Other Experimental: Lustrous, ductile, malleable metal; Mohs' hardness: 3.0; specific resistance: 1.673 microohm/cm; heat of fusion: 48.9 cal/g; heat capacity (solid): 0.092 cal/g/deg C at 20 °C, (liq): 0.112 cal/g/deg C; becomes dull when exposed to air; two naturally occurring isotopes: 63 (69.09%), 65 (30.91%); 9 artificial isotopes;Very slowly attacked by cold hydrochloric acid or dil sulfuric acid; readily by dil nitric acid, and by both not conch sulfuric acid and hydrobromic acid. It is also attacked by acetic acid and other organic acids.;COPPER FORMS TWO SERIES OF SALTS, CU(1+) AND CU(2+) BOTH VALENCE TYPES FORM COMPLEX IONS THAT ARE STABLE.;Ductile, excellent conductor of electricity. Complexing agent, coordination numbers 2 and 4. More resistant to atmospheric corrosion than iron, forming green layer of hydrated basic carbonate. Readily attacked by alkalies. Noncombustible, except as powder.;ELECTRONEGATIVITY (PAULING SCALE): 1.90;Dissolved readily in nitric acid and hot concentrated sulfuric acids slowly, but only when exposed to the atmosphere.
• Ratio: 0.34
• Risk Codes: 11
• Rotatable Bond Count: 0
• RTECS Number: GL5325000
• Safety Description: 16
• Specific Heat: 0.39 kJ/kg K
• Stability: BECOMES DULL WHEN EXPOSED TO AIR. IN MOIST AIR GRADUALLY BECOMES COATED WITH GREEN BASIC CARBONATE.
• Thermal Conductivity: 401 W·m-1·K-1
• Thermal Expansion: (25 °C) 16.5 µm·m-1·K-1
• UNII: 789U1901C5
• UN Number: 3089;3077
• Vapor Pressure: 0 mm Hg (approx) (NIOSH, 2016);1 mm Hg @ 1628 °C;0 mmHg (approx);0 mmHg (approx)
• Vickers Hardness: 369 MPa
• Young's Modulus: 110-128 GPa

Custom Q&A

What is the molecular weight of Copper Nanorods?

The molecular weight of Copper Nanorods is 63.55 g/mol.

When was Copper Nanorods created and last modified?

Copper Nanorods was created on September 16, 2004, and last modified on November 25, 2023.

What is the molecular formula for Copper Nanorods?

The molecular formula for Copper Nanorods is Cu.

What are some synonyms for Copper Nanorods?

Some synonyms for Copper Nanorods are Copper, Copper powder, and cuprum.

How is Copper Nanorods described by the ATSDR?

Copper Nanorods are described as a reddish lustrous malleable odorless metallic solid by the ATSDR.

What is the IUPAC Name of Copper Nanorods?

The IUPAC Name of Copper Nanorods is copper.

What is the Canonical SMILES for Copper Nanorods?

The Canonical SMILES for Copper Nanorods is [Cu].

What is the UNII number for Copper Nanorods?

The UNII number for Copper Nanorods is 789U1901C5.

What is the EC Number for Copper Nanorods?

The European Community (EC) Number for Copper Nanorods is 231-159-6.

What is the CAS number for Copper Nanorods?

The CAS number for Copper Nanorods is 7440-50-8.