Chemical etching can help reveal hidden anomalies or defects such as cracks, rings, or corrosion in materials or components. Alfa Chemistry' experts have experience in different types of advanced chemical etching including aluminium clean etching, anodic etching, blue etching anodizing, and nitric acid ethanol etching. We offer etching services based on Oxford 80+ ICP RIE.
Oxford 80+ ICP RIE
Gas Selection: O2, SF6, CF4, CHF3, Ar
Coil and Bias Powers: 600 W and 600 W
Allowed Materials*: Si, SiO, SiN, Nb, NbN, Ta, Ge, Positive resist, PMMA
Banned Materials*: Au, Ag, Pt, Cu, Most other materials.
Due to the ever-changing nature of research, and the sensitive nature of the equipment these lists are incomplete. Please contact a staff member to discuss etch plans before attempting to etch a new material.
The Oxford Plasmalab 80 Plus Inductively Coupled Plasma Reactive Ion Etcher (ICP RIE) provides etching capability for superconductors and select other "clean" materials. It uses fluorine chemistry along with oxygen and argon to etch films on the nanometer to micron scale. This open load system has a two inch graphite clamp for use with helium backside cooling, as well as replaceable quartz and graphite platens for different etch chemistries.
Alfa Chemistry offers Oxford 80+ ICP RIE-based etching services, please feel free to contact us if you are interested.
For research use only, not intended for any clinical use.
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Alfa Chemistry provides customized laboratory services to research institutes, universities, and other institutions in the field of chemistry and materials. Our mission is to provide you with comprehensive and powerful technical support.
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