Chemical Vapour Deposition (CVD) is a chemical technique for the epitaxial deposition of films of solid materials on the surface of a substrate in the gas phase of a controlled chemical reaction. CVD, also known as thin film deposition, is widely used in electronics, optoelectronics, catalysis, and energy applications such as semiconductors, silicon wafer preparation, and printable solar cells. Alfa Chemistry offers you GSI 2000 PECVD-based chemical vapor deposition services.
GSI 2000 PECVD
The GSI PECVD uses 5% SiH4, N2O, and NH3 plasma to deposit silicon oxides and nitrides for masking and insulating substrates. The chamber is open load. Typical process temperatures are 300 to 400 C.
Alfa Chemistry offers you the technical support for chemical vapor deposition which has been widely used for the purification of substances, the development of new crystals, and the precipitation of various inorganic thin film materials in single, polycrystalline or glassy forms. If you are interested, please contact us directly.
For research use only, not intended for any clinical use.
Please fill out the form below and we will get back to you as soon as possible with a quotation for the item you are interested in.
Alfa Chemistry provides customized laboratory services to research institutes, universities, and other institutions in the field of chemistry and materials. Our mission is to provide you with comprehensive and powerful technical support.
Privacy Policy | Cookie Policy | Copyright © 2025 Alfa Chemistry. All rights reserved.