Catalog Number
ACM7440508-9
Category
Reference/Calibration Standards
Description
insulated wire, 0.1m, conductor diameter 0.1mm, insulation thickness 0.01mm, PTFE (polytetrafluoroethylene) insulation, 99.99%
Synonyms
CHEBI:28694; Copper, rod, 200mm, diameter 2.0mm, as drawn, 99.99+%; Copper, wire reel, 5m, diameter 0.75mm, as drawn, 99.98+%; Copper, rod, 200mm, diameter 9.5mm, hard, 99.9%; Copper, foil, thickness 0.25 mm, length 2 m, purity 99.9%; Copper, foil, thickness 0.15 mm, size 100 x 100 mm, purity 99.9%; Copper powder, 5% in graphite; Copper - O.F.H.C., foil, 5m coil, thickness 0.1mm, hard, 99.95+%; Copper granulated; Copper, foil, thickness 0.038 mm, length 2 m, purity 99.9%;
InChI
1S/Cu,RYGMFSIKBFXOCR-UHFFFAOYSA-N
InChI Key
RYGMFSIKBFXOCR-UHFFFAOYSA-N
Boiling Point
4703 °F at 760 mm Hg (NIOSH, 2016)
Melting Point
1083.4 °C (lit.)
Density
8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94
Solubility
Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble
Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
Assay
99.95% trace metals basis
Color/Form
Reddish, lustrous, ductile, malleable metal;Red metal; cubic
Covalently-Bonded Unit Count
1
Electrical Resistivity
1.673 μΩ-cm, 20°C
Heat of Vaporization
1150 cal/g
Monoisotopic Mass
62.929597g/mol
Octanol Water Partition Coefficient
-0.57 (calculated);
Odor
Odorless /Copper dusts and mists/
Other Experimental
Lustrous, ductile, malleable metal; Mohs' hardness: 3.0; specific resistance: 1.673 microohm/cm; heat of fusion: 48.9 cal/g; heat capacity (solid): 0.092 cal/g/deg C at 20 °C, (liq): 0.112 cal/g/deg C; becomes dull when exposed to air; two naturally occurring isotopes: 63 (69.09%), 65 (30.91%); 9 artificial isotopes;Very slowly attacked by cold hydrochloric acid or dil sulfuric acid; readily by dil nitric acid, and by both not conch sulfuric acid and hydrobromic acid. It is also attacked by acetic acid and other organic acids.;COPPER FORMS TWO SERIES OF SALTS, CU(1+) AND CU(2+) BOTH VALENCE TYPES FORM COMPLEX IONS THAT ARE STABLE.;Ductile, excellent conductor of electricity. Complexing agent, coordination numbers 2 and 4. More resistant to atmospheric corrosion than iron, forming green layer of hydrated basic carbonate. Readily attacked by alkalies. Noncombustible, except as powder.;ELECTRONEGATIVITY (PAULING SCALE): 1.90;Dissolved readily in nitric acid and hot concentrated sulfuric acids slowly, but only when exposed to the atmosphere.
Packaging
1 ea in rigid mailer
Physical Description
Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid.;
Stability
BECOMES DULL WHEN EXPOSED TO AIR. IN MOIST AIR GRADUALLY BECOMES COATED WITH GREEN BASIC CARBONATE.
Topological Polar Surface Area
0A^2
Vapor Pressure
0 mm Hg (approx) (NIOSH, 2016);1 mm Hg @ 1628 °C;0 mmHg (approx);0 mmHg (approx)
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