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Home > Product > Material & Chemicals > Micro/NanoElectronics > Palladium(ii)propionate

Palladium(ii)propionate | CAS Number: 3386-65-0

Catalog Number
ACM3386650
Product Name
Palladium(ii)propionate
Structure
CAS Number
3386-65-0
IUPAC Name
palladium(2+);propanoate
Synonyms
PALLADIUM(II) PROPIONATE;PALLADIUM(II) PROPIONATE, 99.9+%;Palladiumpropionate;Palladium(II) propionate >=99.9% trace metals basis
Molecular Weight
252.56
Exact Mass
251.96100
Molecular Formula
C6H10O4Pd
Boiling Point
141.7ºC at 760 mmHg
Melting Point
154-156ºC(lit.)
Flash Point
57.7ºC
Purity
96%
SMILES
CCC(=O)[O-].CCC(=O)[O-].[Pd+2]
InChIKey
ZVSLRJWQDNRUDU-UHFFFAOYSA-L
H-Bond Donor
0
H-Bond Acceptor
4
Safty Description
26-36
Hazard Statements
Xi: Irritant;
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1Design of a new, multi-purpose, light-curing adhesive comprising a silane coupling agent, acidic adhesive monomers and dithiooctanoate monomers for bonding to varied metal and dental ceramic materials.

Ikemura K1, Tanaka H, Fujii T, Deguchi M, Negoro N, Endo T, Kadoma Y.

Dent Mater J. 2011;30(4):493-500. Epub 2011 Jul 21.

A newly designed, light-curing adhesive was investigated for its bonding effectiveness to porcelain, alumina, zirconia, Au, Au alloy, Ag alloy, Au-Ag-Pd alloy, and Ni-Cr alloy. Four experimental adhesives were prepared using varying contents of the following: a silane coupling agent [3-methacryloyloxypropyltriethoxysilane (3-MPTES)], acidic adhesive monomers [6-methacryloyloxyhexyl phosphonoacetate(6-MHPA),6-methacryloyloxyhexyl3-phosphonopropionate(6-MHPP)and 4-methacryloyloxyethoxycarbonylphthalic acid (4-MET)], and dithiooctanoate monomers [6-methacryloyloxyhexyl 6,8-dithiooctanoate (6-MHDT) and 10-methacryloyloxydecyl 6,8-dithiooctanoate (10-MDDT)]. Read More

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Tel:1-201-478-8534
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Address: Suite 212, Waverly Plaza, 755 Waverly Avenue, Holtsville, NY 11742, USA