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Home > Product > Metal Organics > Organic Copper > Copper formate

Copper formate | CAS Number: 544-19-4

Catalog Number
ACM544194
Product Name
Copper formate
Structure
CAS Number
544-19-4
IUPAC Name
copper diformate
Synonyms
COPPER (II) FORMATE;CUPRIC FORMATE;COPPER FORMATE;cupricdiformate;formicacid,copper(2+)salt;formicacid,copper(2+)salt(1:1);formicacid,copper(2++)salt;copper diformate
Molecular Weight
153.58
Exact Mass
108.93500
Molecular Formula
C2H2CuO4
Boiling Point
100.6ºC at 760 mmHg
Melting Point
130ºC
Flash Point
29.9ºC
Density
1,831
Purity
96%
Appearance
Blue crystalline powder. Sinks and mixes with water.
InChIKey
HFDWIMBEIXDNQS-UHFFFAOYSA-L
H-Bond Donor
0
H-Bond Acceptor
4
Safty Description
22-36/37/39
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1Synergetic Effect of Blended Alkylamines for Copper Complex Ink To Form Conductive Copper Films.

Xu W1, Wang T1.

Langmuir. 2016 Dec 29. doi: 10.1021/acs.langmuir.6b03668. [Epub ahead of print]

Cu(II) complex ink consisting of copper formate (Cuf) and a primary alkylamine could yield highly conductive copper films at low heating temperatures without a reducing atmosphere. A synergetic effect of the blended alkylamines on the formation of conductive films was observed. It was found that blending two types of amines with different alkyl chain lengths as ligands could improve the conductivity of copper films, compared with using one of these amines alone. Read More

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Tel:1-201-478-8534
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