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Triphenylsilane | CAS Number: 789-25-3

Catalog Number
ACM789253
Product Name
Triphenylsilane
Structure
CAS Number
789-25-3
EC Number
212-333-0
IUPAC Name
tri(phenyl)silicon
Synonyms
Triphenylsilane, Silane, triphenyl-, 148504_ALDRICH, NSC12565, EINECS 212-333-0, NSC 12565, 789-25-3
Category
Organic hydrogen silane
Molecular Weight
260.41
Exact Mass
260.10200
Molecular Formula
C18H16Si
Boiling Point
152ºC (2 mmHg)
Melting Point
43-46ºC
Flash Point
76ºC
Purity
95%+
Appearance
Transparent liquid
SMILES
C1=CC=C(C=C1)[Si](C2=CC=CC=C2)C3=CC=CC=C3
InChIKey
BZLZKLMROPIZSR-UHFFFAOYSA-N
H-Bond Donor
0
H-Bond Acceptor
0
Safty Description
S26
Hazard Statements
Xi:Irritant;
WGK Germany
1
Stability
Stable at room temperature in closed containers under normal storage and handling conditions.
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1A Dinitrogen Dicopper(I) Complex via a Mixed-Valence Dicopper Hydride.

Zhang S1, Fallah H2, Gardner EJ1, Kundu S1, Bertke JA1, Cundari TR3, Warren TH4.

Angew Chem Int Ed Engl. 2016 Aug 16;55(34):9927-31. doi: 10.1002/anie.201603970. Epub 2016 Jul 13.

Low-temperature reaction of the tris(pyrazolyl)borate copper(II) hydroxide [(iPr2) TpCu]2 (μ-OH)2 with triphenylsilane under a dinitrogen atmosphere gives the bridging dinitrogen complex [(iPr2) TpCu]2 (μ-1,2-N2 ) (3). X-ray crystallography reveals an only slightly activated N2 ligand (N-N: 1.111(6) Å) that bridges between two monovalent (iPr2) TpCu fragments. While DFT studies of mono- and dinuclear copper dinitrogen complexes suggest weak π-backbonding between the d(10) Cu(I) centers and the N2 ligand, they reveal a degree of cooperativity in the dinuclear Cu-N2 -Cu interaction. Read More

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Tel:1-201-478-8534
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Fax: 1-516-927-0118
Address: Suite 212, Waverly Plaza, 755 Waverly Avenue, Holtsville, NY 11742, USA